STM and JESDAF respectively. A typical Human Body Model circuit is presented in Figure 1. Figure 1: Typical Human Body Model Circuit. In September , a small group of ESD control and design stakeholders assembled in a Read More». In the EERC Resource Center. A Dash of Maxwell’s. JESDAF. – IEC (C= pF). – MIL method Pulse parameters. HBM. Reference voltage. 2KV 4KV. Peak current. A A.
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The pin combination with the waveform closest to the limits see Table 1 shall be designated for waveform verification.
ESD Tests | Reliability Technology Division | Services | OKI Engineering
The period between waveform checks may be extended providing a11f4 data supports the increased interval. Longer intervals are still permitted. However, if a pin intended to supply power to a circuit on another chip but not to any circuit on the same chip, it may be treated as a signal pin. Any pin that is intended to supply power to another circuit on the same chip must be treated as a power pin. If at any time the waveforms do not meet the requirements defined within Figure 2 and Table 1 at the V or V level, the testing shall be halted until the jesf22 is in compliance.
NOTE 3 R2, used for initial equipment qualification and requalification as specified in 3. Place the current probe around the shorting wire.
The number of power pins tested on Terminal A may be reduced if the power pin group is connected on a package plane see clause 4. Clarified power pin definitions. Added third reference to table: The number of power pins tested on Terminal A may be reduced if the power pin group is connected on a package plane see clause 4.
The actual number of pin combination sets depends on the number of power pin groups. Scanning for the presence of any trailing pulse shall cover a period of at least 1 msec after the HBM pulse. Apply a positive and negative V pulse and verify that the waveform meets the requirements defined in Table jewd22. Connect this pin to Terminal B where it will remain the referenced pin throughout the worst-case pin search and connect one of the remaining pins to Terminal A.
Jese22 Test plan would as follows: This shunt resistance can be placed in the HBM simulator or in the test fixturing system. All pins one at time to Gnd3 power pin group 4.
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)
The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. As an alternative to this method, it is permitted to partition the pins to be connected to terminal B into two or more subsets, such that each of these pins is a member of at least one subset.
Some punctuation changes are not included. All pins one at time to Vdd1 power pin group 5. Additionally, all personnel shall receive system operational training and electrical safety training prior to using the equipment.
All pins one at time to Gnd1 power pin group 2. The characteristics of this pre-pulse phenomenon depend on the conditions and the environment of the arcing associated with the HBM discharge, jed22 parasitic capacitances of the tester, as well as the pin impedance of the device under test.
Due to this effect the current waveform seen at Terminal B would not match the one seen using a a14f, 2-pin HBM test between the same set of pins. Precautions must a11f taken in tester design to avoid recharge transients and multiple pulses. Vpp pins on memory devices. In that case, the pin may be tied together with the power pin s connected to the same bus and treated as one pin for Terminal B connection even though it is labeled a different name.
However, if a pin intended to supply power to a circuit on another chip but not to any circuit on the same chip, it jssd22 be treated as a signal pin. The tester-dependent voltage rise was observed to jess22 the timing of the protection action. Machine repeatability should be verified during initial equipment acceptance by performing a minimum of 5 consecutive positive and a minimum of 5 consecutive negative waveforms at a voltage level in Table 2. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting jfsd22 purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
The reference pin combination shall be identified by determining the socket pin with the shortest wiring path from the pulse generating circuit to the test socket. Recalibration is required whenever equipment repairs are made that may affect the waveform and a minimum of every 12 months. All pins which are not connected to the die shall be verified as such and left open floating at all times. The tester must meet the requirements of Table 1 and Figure 2 at all voltage levels, except V, using the shorting wire and at the V and V levels with the ?
Otherwise, each power pin must be treated as a separate power pin. All pins one at time to Gnd3 power pin group 4. The high-voltage relays and associated high-voltage circuitry shall be tested by the user of computercontrolled systems per the equipment manufacturer’s instructions system diagnostics.
The tester-dependent voltage rise was observed to alter the timing of the protection action. The probe transformer and cable with a nominal length of 1 meter shall have a 1 GHz bandwidth, a minimum current rating of 12 amperes peak pulse-current capability and a rise time of less than one nanosecond. The pin connected to terminal A is to be stressed to each of these subsets separately. Each Vdd2 pin Vdd2. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met.
The lead length should be as short as practicable to span the distance between the two farthest pins in the socket while passing through the current probe. All comments will be collected and dispersed to the appropriate committee s. It is permitted to use the same sample 3 at the next higher voltage stress level if all parts pass the failure criteria specified in clause 5 after ESD exposure to a specified voltage level. It is permitted to further partition each pin combination set in Table 2 and use a separate sample of 3 devices for each subset within the pin combination set.
Other pins in the group do not need to be stressed. For the initial board check-out connect a ? Clarified that pin combination sets may be partitioned as far as necessary and performed on different devices to eliminate possible cumulative effects. The measured voltage and the time that it is present on the device can then be compared to the known reliability mechanisms of the technology, such as time dependent dielectric breakdown TDDBto determine if a reliability concern is posed by the HBM tester.
This shunt resistance can be placed in the HBM simulator or in the test fixturing system. Included pins connected to charge pump capacitors as power pins.
The high-voltage relays and associated high-voltage circuitry shall be tested by the user of computercontrolled systems per the equipment manufacturer’s instructions system diagnostics.